Summary: We carried out our regular survey of the Asia tech markets in late February and early March. We believe semiconductor and electronic component procurement has become overheated, premised on record-high PC volume in 2021, along with auto production volume of 110–120mn units. Semiconductor-related ordering is disconnected from actual demand, and the book-to-bill ratio (BB) for discrete devices exceeded 2.0 in February, with POs reaching up to one year’s worth of chips. Many industry observers expect inventory adjustments sometime in 2H 2021 or 1Q 2022. Give that the current semiconductor supply shortage arose only after media reports about automakers halting production, and that demand forecasts have been raised regardless of application, an emerging sense of reassurance in the industry after supply catches up with actual automaker demand (i.e., auto production) in May–Jun would probably lead to inventory adjustments. In DRAM and NAND, we think market conditions will lead to price increases in the near term. The current semiconductor capex cycle is widely expected to peak out, as the positive turnaround in memory market prices is not making memory makers less cautious in their final investment decisions, and logic/foundry capex is in a lull in 1H 2021. In back-end SPE, inquiries are no longer overheated like in 4Q 2021, but remain at a high level, and SPE manufacturers are projected to operate at full capacity through Aug–Sep. We think that with regard to the tech sector, the stock market’s full attention will be on whether and when there will be semiconductor inventory adjustments. The excess procurement will end eventually.
相关报告
最新翻译1.9万字!《欧洲芯片法案》-中英对照
7669
类型:法律合同
上传时间:2022-02
标签:芯片法案、数字化、半导体)
语言:中英
金额:7元
美国智库3文字报告:半导体与为地缘政治服务的供应链监管(中英文版)
6638
类型:行研
上传时间:2021-09
标签:半导体、供应链监管)
语言:中英
金额:7元
美国智库1.2万字报告:2021美国国家半导体行业报告(中英文版)
6099
类型:行研
上传时间:2021-10
标签:半导体、芯片短缺)
语言:中英
金额:5元
最新翻译2万字美国总统咨询报告《振兴美国半导体生态系统》(中英对照)
4793
类型:专题
上传时间:2022-11
标签:半导体、美国战略)
语言:中英
金额:5元
国际投行报告-全球芯片行业:芯片的冲突-台积电、三星和英特尔(英)
4390
类型:行研
上传时间:2022-06
标签:投行报告、芯片、冲突)
语言:英文
金额:5积分
HSBC-中国房地产和物业管理行业2022年展望-2021.11.9-75页
3754
类型:行研
上传时间:2021-11
标签:投行报告、房地产、物业)
语言:英文
金额:5积分
汇丰-中国汽车芯片
3652
类型:行研
上传时间:2022-07
标签:汽车、芯片、投行报告)
语言:英文
金额:5积分
半导体行业龙头建模方法合集
3582
类型:公司/个股
上传时间:2020-09
标签:半导体、集成电路)
语言:中文
金额:380元
《芯片战争》168页读书笔记by曦夕
3337
类型:读书笔记
上传时间:2024-01
标签:半导体、芯片产业、企业竞争)
语言:中文
金额:9.9元
美国智库2.8万字报告-中国在半导体领域的创新程度如何?
3084
类型:行研
上传时间:2024-09
标签:半导体、研发创新、行业分析)
语言:中英
金额:10元
积分充值
30积分
6.00元
90积分
18.00元
150+8积分
30.00元
340+20积分
68.00元
640+50积分
128.00元
990+70积分
198.00元
1640+140积分
328.00元
微信支付
余额支付
积分充值
应付金额:
0 元
请登录,再发表你的看法
登录/注册