2021 sector strength to continue. We expect a positive outlook for 2021 with the sector momentum continuing, and our US analyst John Pitzer modeling +14% YoY semiconductor growth to US$500bn driven by (1) 5G units ramping from 257mn to 528mn, (2) hyperscale capex growing +16% YoY, (3) stay-at-home momentum sustaining through 1H21, (4) auto/industrial poised for pick-up with vaccine, (5) supply chain inventory drawing down through 2H20 and (6) IoT connectivity growth continuing. Key risk is faster slowdown of stayathome demand though we view 5G, data center and auto/industrial offsetting that.
Capacity tighter across the chain. The Asian semi chain is seeing full capacity and firm to rising pricing spanning TSMC’s advanced capacity through mature nodes across the other foundries. Pricing is rising 10-20% on 8”, 5-10% on mature 12” and firm on 40nm and below, with increases now on all other components save for seasonal over-supply in NAND. We would monitor for acceleration of back-end or tier 2 foundry capex, but at this stage new supply is manageable and US restrictions on advanced tools may slow SMIC.
High valuation, but earnings growth continues. The key risk to sector performance is the high base after a strong 2020 with Taiwan foundries up 74% and fabless up 91% the past year, although backend is a laggard only up 8%. Stocks are now at post-crisis highs trading averaging 24x 2021, though still a 10% discount to US semiconductors and recovering from the prior decade’s de-rating. While valuation is high, we model 16% earnings growth for foundry, 12% for fabless and 7% for back-end, supporting some further appreciation if companies continue to deliver good earnings.
Stocks with estimate and target upgrades. We roll over to 2022 valuation and reflect recent strength in estimates. We lifted TSMC TP last week and now lift TPs of UMC, Hua Hong, Vanguard, CHPT, ASE, Powertech, Mediatek, Realtek, and ASpeed. We downgrade ASpeed from Outperform to NEUTRAL with the stock over 50x 2022E EPS. We prefer TSMC (HPC and 5G leverage), UMC (tight capacity/rising pricing), ASE (Rising SiP and improving pricing), CHPT (share recovery), Mediatek (5G/non-mobile growth), Realtek (IoT and content gains), and Nanya (DRAM supply tight and pricing poised to rebound).
相关报告
最新翻译1.9万字!《欧洲芯片法案》-中英对照
7461
类型:法律合同
上传时间:2022-02
标签:芯片法案、数字化、半导体)
语言:中英
金额:7元
美国智库3文字报告:半导体与为地缘政治服务的供应链监管(中英文版)
6474
类型:行研
上传时间:2021-09
标签:半导体、供应链监管)
语言:中英
金额:7元
美国智库1.2万字报告:2021美国国家半导体行业报告(中英文版)
5911
类型:行研
上传时间:2021-10
标签:半导体、芯片短缺)
语言:中英
金额:5元
最新翻译2万字美国总统咨询报告《振兴美国半导体生态系统》(中英对照)
4653
类型:专题
上传时间:2022-11
标签:半导体、美国战略)
语言:中英
金额:5元
国际投行报告-全球芯片行业:芯片的冲突-台积电、三星和英特尔(英)
4179
类型:行研
上传时间:2022-06
标签:投行报告、芯片、冲突)
语言:英文
金额:5积分
HSBC-中国房地产和物业管理行业2022年展望-2021.11.9-75页
3613
类型:行研
上传时间:2021-11
标签:投行报告、房地产、物业)
语言:英文
金额:5积分
半导体行业龙头建模方法合集
3450
类型:公司/个股
上传时间:2020-09
标签:半导体、集成电路)
语言:中文
金额:380元
汇丰-中国汽车芯片
3297
类型:行研
上传时间:2022-07
标签:汽车、芯片、投行报告)
语言:英文
金额:5积分
《芯片战争》168页读书笔记by曦夕
3133
类型:读书笔记
上传时间:2024-01
标签:半导体、芯片产业、企业竞争)
语言:中文
金额:9.9元
美国半导体协会3.8万字报告!加强全球半导体供应链(中英对照)
2944
类型:行研
上传时间:2021-05
标签:半导体、供应链)
语言:中英
金额:10元
积分充值
30积分
6.00元
90积分
18.00元
150+8积分
30.00元
340+20积分
68.00元
640+50积分
128.00元
990+70积分
198.00元
1640+140积分
328.00元
微信支付
余额支付
积分充值
应付金额:
0 元
请登录,再发表你的看法
登录/注册